Beilstein J. Nanotechnol.2017,8, 425–433, doi:10.3762/bjnano.8.45
spectroscopy (EDX) and X-ray diffraction (XRD) analysis shows that the thermal oxidation of the copper nanoparticles and formation of cupricoxide (CuO) on silicon surfaces leads to wetting rather than agglomeration. In contrast, agglomeration has been observed when copper nanoparticles were annealed in a
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Keywords: copper; cupricoxide; electron diffraction; galvanic displacement reaction; oxidation; surface wetting; transmission electron microscopy; Introduction
The transition metal oxide cupricoxide (CuO) is a stable oxide of copper, and due to its diverse applications, immense research on CuO
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Figure 1:
Plan view (a) TEM image (b) STEM-HAADF image of as-deposited copper nanoparticles on Si. Plan view ...